May 18, 2011 – Z-AXIS has added a second automated optical inspection (AOI) system at its contract electronics design and manufacturing center, more than doubling its capacity for rapid inspection of printed circuit board (PCB) assemblies in production. The YESTech YTV B3 automated optical inspection systems handle boards up to 18″ x 20″ (457mm x 508mm) with components as small as 01005, quickly tagging defects such as missing or misaligned components, bent leads or defective solder joints.
The YESTech systems can be quickly re-programmed to handle new PCB designs, supporting Z-AXIS’ strengths in both high-speed and high-mix production runs.
The expanded AOI set-up includes network-based, paperless defect tracking that eliminates inefficient paper tickets. When the vision system identifies a defect in a printed circuit board, detailed information about the defect is automatically logged on the network and a 2D barcode attached to the board. The board is sent to a rework station, where employees scan the barcode to immediately pinpoint the location and nature of the problem. After rework, the quality manager again scans the barcode to quickly confirm proper corrective action.
Paperless tracking not only streamlines the rework and inspection process, but also captures detailed records of defect types and trends, allowing Z-AXIS to identify opportunities for continuous improvement in its manufacturing processes.
“Automated optical inspection is one of the many tools we use to provide consistent high quality, high yields, and competitive pricing in electronics manufacturing,” said Michael Allen, president of Z-AXIS. “Continuously investing in new tools, technology and training both supports and drives the high growth we’ve achieved over the past five years.”
Z-AXIS realized more than 80% growth in its most recent fiscal year and more than 30% average compound revenue growth over the past five years.