April 21, 2016 – Z-AXIS has added capabilities for over-molding elastomers onto cable assemblies and printed circuit board (PCB) assemblies produced at its contract design and manufacturing center near Rochester, NY.
- For cable assemblies, Z-AXIS is using overmolding for strain relief to replace backshells or epoxy. Overmolding provides higher reliability, greater bending flexibility, higher tensile strength and improved moisture resistance. It also makes the assembly process as much as five times faster.
- For PCB assemblies, overmolding adds another option to Z-AXIS’ conformal coating, potting and encapsulation services to protect customers’ PCBs from moisture, dust and vibration. Overmolding provides a higher degree of protection than conformal coating. It is faster than potting and eliminates the need for an extra shell around the PCB assembly to contain the thermoset resin potting compound. This can reduce the size, weight and potentially unit cost of PCB assemblies.
The low-temperature, low-pressure Mold-Man 1050 injection molding machine uses resins with relatively low melting temperatures, injected at low pressure, to safely encapsulate assemblies placed into molds. Low pressure means that economical aluminum molds can be used, making overmolding practical for low- to mid-volume production.
Z-AXIS engineers source resins appropriate for the customers’ requirements. For example, the company is currently using specialty resins that withstand cleaning with alcohol for medical product applications.
Customers can provide prints for overmolded features they have designed, or work with the Z-AXIS design engineering team to develop their concept into a manufacturable solution.
“This overmolding capability is one more factor making Z-AXIS unique among high-mix contract manufacturers in western New York,” said Michael Allen, president of Z-AXIS. “It’s part of our long-standing commitment to continually expanding our range of equipment and services, providing innovative solutions to satisfy our customers’ needs.”